PUR hotmelt adhesive Henkel Technomelt HKP 29 ME, cartridge

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Overview

Description
Henkel Technomelt PUR 29 ME is a PUR hotmelt adhesive with MicroEmission for bonding of all standard edging materials. MicroEmission means that the hotmelt contains less than 0.1 % of isocyanate monomers and reduces harmful isocyanate vapours by up to 90 %. The cartridges are made for processing on Holz-Her edgebanding machines. It is recommended that the system is thoroughly cleaned with Henkel Technomelt Purmelt cleaner after processing. We recommend Henkel Technomelt PUR Cleaner All-in-1 for the cleaning of applicator units and glue containers.
Product advantages
  • Does not require special labelling
  • Non-toxic PUR technology due to minimal amount of isocyanate
  • High initial strength
  • Very high heat resistance and flexibility at low temperatures<ignore>
  • Excellent moisture resistance
  • Produces tight joints</ignore>
Tip
  • MicroEmission PUR-HA: Waterproof bondlines with a minimum of isocyanate steam
Product group
Hotmelt adhesive
Type
Cartridge
Application
Bonding of edgings
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Language
IE
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